Potting glue is used for bonding, sealing, potting and coating protection of electronic components.Potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance, and production process of the product.Only after the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, thermal conductivity, confidentiality, anti-corrosion, temperature resistance, and shockproof.

There are many types of electronic potting adhesives. In terms of material types, there are three main types that are most commonly used, namely epoxy resin potting adhesives, silicone resin potting adhesives, and polyurethane potting adhesives. These three types of potting adhesives can be subdivided into hundreds of different products.

1. Epoxy potting glue

Product features: The resin is composed of epoxy or modified epoxy resin and a curing agent. It can be prepared as a one-component or two-component. The appearance can be made transparent or various colors can be made by adding various functional fillers to achieve light transmission, flame retardant, thermal conductivity, fluorine resistance, insulation, wear resistance, reduce shrinkage or other functions.It can be cured at room temperature or heating, there are no volatiles during the curing process, and it has good processability and electrical properties.The heat resistance grades are B, F, and H.

Application field: Suitable for insulation treatment of small and medium-sized motors, transformers, reactants, controllers, capacitors, ignition coils or electrical windings.

2. Polyurethane potting glue

Product features: It is a and B two-component potting glue.Component A is mainly composed of polyester polyols, fillers, and additives, and component B is divided into curing agents.It has the advantages of low viscosity, good permeability, long storage period, low exothermic temperature during curing, and fast curing at room temperature.The product has excellent adhesion properties and good high and low temperature impact properties. Under high and low temperature conditions, it is not brittle, does not crack, has good toughness, and will not cause damage to electronic components. It has passed UL94V0 flame retardant certification.

Application field: It is suitable for potting of various types of B-class and F-class electronic components.

3. Silicone potting glue

Product features: There are two types of injection molding and condensation type, which can be made into transparent or various colors, and various types of functional fillers can also be added to achieve light transmission, flame retardant, thermal conductivity, insulation, heat resistance, cold resistance, moisture resistance, aging resistance, seismic resistance, repair or other functions.It can maintain rubber elasticity over a wide temperature range (-45℃～200℃), is non-toxic, non-corrosive, safe and environmentally friendly, has low internal stress in the cured material, and has no volatile components during the curing process. The cured material has good adhesion to metal, PPO, ABS and other substrates.

Application field: Suitable for fixed packaging of electronic components and waterproof, dustproof and leakage-proof.Such as electronic and electrical modules, motors, transformers, power modules, rectifier circuits, etc.